Afterburn 3.2 For 3ds Max 2008 (32-bit Version) 64 Bit
Introduced in August 2006, the first-generation Mac Pro had two dual-core Xeon Woodcrest processors and a rectangular tower case carried over from the Power Mac G5. It was replaced on April 4, 2007, by a dual quad-core Xeon Clovertown model, then on January 8, 2008, by a dual quad-core Xeon Harpertown model. Revisions in 2010 and 2012 revisions had Nehalem/Westmere architecture Intel Xeon processors.
Afterburn 3.2 for 3ds Max 2008 (32-bit version) 64 bit
The original Mac Pro's main memory uses 667 MHz DDR2 ECC FB-DIMMs; the early 2008 model uses 800 MHz ECC DDR2 FB-DIMMS, the 2009 and onward Mac Pro use 1066 MHz DDR3 ECC DIMMs for the standard models, and 1333 MHz DDR3 ECC DIMMs for systems configured with 2.66 GHz or faster CPUs. In the original and 2008 models, these modules are installed in pairs, one each on two riser cards. The cards have 4 DIMM slots each, allowing a total of 32 GB (1 GB = 10243 B) of memory (8 4 GB) to be installed. Notably, due to its FB-DIMM architecture, installing more RAM in the Mac Pro will improve its memory bandwidth, but may also increase its memory latency. With a simple installation of a single FB-DIMM, the peak bandwidth is 8000 MB/s (1 MB = 10002 B), but this can increase to 16000 MB/s by installing two FB-DIMMs, one on each of the two buses, which is the default configuration from Apple. While electrically the FB-DIMMs are standard, for pre-2009 Mac Pro models Apple specifies larger-than-normal heatsinks on the memory modules. Problems have been reported by users who have used third party RAM with normal size FB-DIMM heatsinks. (see notes below). 2009 and later Mac Pro computers do not require memory modules with heatsinks.
The 2008 model had two PCI Express (PCIe) 2.0 expansion slots and two PCI Express 1.1 slots, providing them with up to 300 W of power in total. The first slot was double wide and intended to hold the main video card, arranged with an empty area the width of a normal card beside it to leave room for the large coolers modern cards often use. In most machines, one slot would be blocked by the cooler. Instead of the tiny screws typically used to fasten the cards to the case, in the Mac Pro a single "bar" held the cards in place, which is itself held in place by two "captive" thumbscrews that can be loosened by hand without tools and will not fall out of the case.
The bandwidth allocation of the PCIe slots can be configured via the Expansion Slot Utility included with Mac OS X only on the August 2006 Mac Pro. The Early-2008 and later Mac Pros had PCIe slots hardwired as in the accompanying table.
The Mac Pro Xeon Ws feature Turbo Boost (dynamic frequency scaling, allowing the CPU "overclock" when demanding tasks are running), Hyper-threading ( Intel's proprietary simultaneous multithreading that allows for a single core to be addressed as two cores to share workloads when possible), dual AVX-512 Vector units with FMA (fused multiply add) support and six DDR4 memory channels. AVX (Advanced Vector Extensions) are additional instruction sets for x86 that were proposed by Intel and AMD in 2008 and later adopted in CPU designs. The latest is AVX-512. Due to long-tail support and slow adoption of AVX changes by AMD, AVX requirements for applications have been slow to roll out on both macOS and Windows. Rosetta under Apple Silicon does not support AVX translation, also further reducing adoption by programmers to use AVX under macOS.